What are the production stages of PCBA processing?

PCBA is the process of PCB circuit board manufacturing, component procurement and inspection, SMT surface mount processing, plug-in processing, program burning, testing, aging, etc. The PCBA processing process involves many links. In order to produce good products, we must control the quality of each link.

1. Manufacturing of PCB circuit boards.

After receiving the PCBA order, analyze the Gerber file, pay attention to the relationship between PCB hole spacing and board load capacity, avoid bending or breaking, and consider key factors such as high-frequency signal interference and impedance in wiring.

2. Component procurement and inspection.

The procurement of components requires strict control over channels, and must be picked up from large traders and original factories to avoid 100% second-hand and fake materials. In addition, a dedicated incoming inspection position has been established to strictly inspect the following items to ensure that the components are free of faults.

PCB: Reflow soldering furnace temperature test. No flying lines allowed. Is the through-hole blocked or leaking ink; Is the board surface bent;

IC： Check if the silk screen printing is completely consistent with the BOM and store it at a constant temperature and humidity;

Other common materials: check silk screen printing, appearance, electrical measurement values, etc. The inspection items are carried out according to the sampling method, and the proportion is generally 1-3%.

3. SMT surface mount processing.

The temperature control of solder paste printing and reflow soldering furnace is the key point, and it is very important for the quality of laser steel mesh to meet the process requirements. According to the requirements of PCB, some steel mesh needs to be added or reduced, or U-holes need to be used, and steel mesh should be made according to the process requirements. The gentle speed control of the reflow soldering furnace is crucial for the penetration of solder paste and the reliability of soldering, and can be controlled according to normal SOP operation guidelines. In addition, it is necessary to strictly implement artificial intelligence testing to reduce the adverse effects caused by human factors.